connection imbalances that may cause thermal
imbalances during the IR reflow soldering
process, which can lead to Tomb-Stone defects.
User defined limits, either by percentage of
the connection width or by an absolute value.
Visit each device using the report viewer window.
Verify and locate copper connection imbalances
Avoid soldering problems before they occur.
|Cline Connection Imbalance||Via Connection Imbalance||Shape Connection Imbalance|
|Chip Balance Report Window|