| SAdd_ArcSeg |
The purpose of this program is to convert a diagonal copper track into arc segments.
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| SAdd_Breakout |
A breakout pattern can be captured and stored in a file so that it can be reused in other designs.
Users can also search the library for the available patterns.
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| SAdd_Fanout |
This is a breakout generator. Depending on the selected device, this program will
generate a break-out pattern.
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| SAdd_TwinSeg |
This program is used to clone segment and also allows user to define the edge-to-edge spacing.
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| SAdd_MiscPad |
This program is used to add two (2) miscellaneous-pads on layer 'PP' (Primary Process Layer) and
'PS' (Secondary Process Layer) of vias found under user-selected-areas.
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| SAdd_MMVia |
This program is used to add Silkscreen to the device's outline, Via and breakout via.
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| SAdd_MMViaRest |
This program is used to add/delete via restricted areas over silkscreen lines, text, orientation dots and fiducial
targets.
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| SAdd_ParallelSeg |
This program is used to make a copper-track parallel to another and also allows users to define the edge-to-edge
spacing. This program is intended for users who want to make differential pairs interactively.
This program has 6 functions:
- MakeParallel
- TrackExtend
- TrackClone
- MergeSignal
- AngleQuery
- TrackMove
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| SAdd_Seg |
this program is to add copper-tracks when the exact length is required.
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| SAdd_SegClone |
this program is to clone segment's pattern when two ends of the pattern carry 2 different signals or same signal.
Unicad's Route Repeat only works when both ends carry the same signal.
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| SAdd_SegRest |
This program is to ADD/DELETE Restricted-Areas on top of Copper-Tracks.
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| SAdd_SRText |
This program is used to ADD/DELETE solder-resist on top of texts on layers Primary or Secondary.
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| SAdd_Via |
This program is used to ADD vias to TestPads.
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| SAdd_WorkArea |
This program is used to ADD WorkingArea by scaling the board's outlines. It also reports the
Board's vertices (Counter-Clockwise).
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| SGen_Device |
This program reports any PCodes found on both Primary and Secondary layers.
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| SGen_pincount |
This program reports the total pin-count in the design.
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| SGen_PinSig |
This program reports the pins that have Signal specified by users.
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| SGen_SegWidSeg |
This program reports the TRACK-WIDTH as per user defined signal names.
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| SMod_ChangeSig |
This program is used to change the pin-signals to a new signal as per user selected-areas.
This program become useful when user wants to re_use part of a design; then this program is
used to change the signal names to ".NC."
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| SMod_DelDevGate |
This program is used to:
- Del AllGates in Layout.
- Del UnassignGates in Layout.
- Del Device Without Gate in Layout.
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| SMod_DelSOPaste |
This program is used to delete solderpaste of Miscpins.
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| SMod_DevRelayer |
This program is used to "Relayer" devices on PRI -> SEC and vice versa.
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| SMod_MM |
This program is used to change the silkscreen texts to a new size.
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| SMod_MMText |
This program is used to generate silkscreen texts as per user selected layers.
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| SMod_MultiDel |
This program is used to Delete/Unplace Layout's objects as user selected per layer.
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| SMod_NullPad |
In a selected boxed area, this program nulls thru hole pins or vias on all internal layers,
provided that there is no attached copper on that layer (ie tracks and/or planes).
Users are suggested to run this program before copper planes are added so that the run time
can be improved.
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| SMod_Pads |
This program is used to change the Pins or CopperBalance pads as per user's defined area.
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| SMod_SegWidth |
This program is used to change the track's width as per user's defined layers.
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| SMod_SigTestpad |
This program is used to find signal w/o testpoint and then add the testpoint.
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| SMod_tp4BGA |
This program is used to modify the pad_shape of via and breakoutvia's testpoints found under BGA so that
the testpads are as large as possible without causing any violations.
The program tries if it can relocate the TestPoints to another ThruHole pins, Vias or Breakoutvias found outside the BGA
If the TestPoints can NOT be relocated outside the BGA, the program tries to modify the size of the vias and the breakoutvias
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| SMod_UnusePin |
This program is used to change the signal name of the Unused-Pin from .NC. to NU-XXX. The counter XXX
is a numerical value incremented by 1. Note: Unused-Pin are pins that have pin-name (ie. MCLK0) and have signal as .NC.,
NoConnect-Pin are pins that have pin-name NC and have signal as .NC.
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| SMod_ViaHolesize |
This program is used to change via's hole size and via's shape as per user defined area.
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| SMod_ViaConv |
This program is used to convert "Regular via" to either "Blind vias" or "Buried vias".
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| SMod_ViaTP2TP |
This program is used to convert Via-Testpads to Testpads of the signal .NC. so that more space can be gained
for the Spectra to route a board.
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| SMod_ViaTPLock |
This program is used to LOCK/UNLOCK Testpad-Vias so that tracks can be deleted (using area delete mode)
without removing any Testpad-Vias.
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| SVer_Pol |
This program is used to verify the polarities of the discrete devices.
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| SVer_SSSp |
This program is used to verify the minimum spacing is maintained between same-signal objects
and that signal .NC. is not connecting any device pins together.
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| SMod_DiffPair |
This program is used to identify, check and maintain a very specific spacing gap between the differential pair signals.
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